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Plasma enhanced chemical vapor deposition (PECVD)
It is a chemical vapor deposition process which uses plasma for thin film deposition. Thin films and coatings can be deposited from respective precursor chemical vapors using RF plasma. This technique has been used to deposit Diamond Like Carbon (DLC) and metal doped DLC coatings over stainless steel and Ti alloys for enhancing tribological properties.
Specification
Base pressure: 5.0 × 10-6 mbar
Antenna: Inductive coupling
RF generator Power: Maximum 600 W
