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RF and DC Dual Chamber Magnetron Sputtering System
RF and DC magnetron sputtering system deposits source (target) material on a substrate by ejecting neutral atoms from the target through plasma bombardment. The plasma is created through ionization of an inert gas by applying DC or RF field at low pressure and magnetron is used to focus the plasma to the target for efficient deposition.
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Equipment Details
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Key Features
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Application Areas
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Model: RMS 2000L series Manufacturer:Rocky Mountain Vacuum Tech, USA Target size: 3" RF power: 600W DC power:1000W Vacuum: 10-9 mbar
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control ceramics and metal coating system
load lock chamber for inter chamber transportation of the sample
800oC
rotating substrate carrier for uniform coating
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