A low-temperature hot pressing of hexagonal boron nitride (hBN) powder to fabricate hexagonal boron nitride compacts/discs/bodies.
Year of Development
2024-25
Salient Technical Features
The processing method mainly eliminates requirements such as high-temperature equipment and maintenance costs due to low-temperature processing.
Level/Scale of Development
TRL=3
Applications
Dielectric for radar antennas and windows, Neutron absorbers and shields for nuclear reactors, wafers for boron-doping of semiconductors
Commercialization
Not Yet
Available in Market
Not yet
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