The VSU28 Vacuum solder reflow oven is a high-end, programmable vacuum reflow soldering and brazing oven with both bottom and optional top IR heating. It handles flux-free processes in vacuum, inert gases, nitrogen, formic acid, and forming gas. Engineered for R&D and production, its 260 × 210 mm heater plate supports void-free solder joints and hermetic seals with rapid thermal ramps.
- Vacuum/inert-gas reflow for Surface Mount Technology (SMT) and hybrid assemblies
- Die attach, flip-chip, power semiconductors, high-brightness LEDs
- Hermetic packages (MEMS, opto-devices, sensors), photovoltaic cells
- Printed copper film sintering, hybrid circuits, flat‑pack encapsulation, automotive sensors, high‑energy battery components
Vacuum Reflow Soldering
Enables flux-free soldering under vacuum conditions to reduce voids in solder joints.
Suitable for power electronics, sensor modules, and high-reliability PCBs.
Controlled Atmosphere Processing
Reflow in inert gases (N₂, Ar, He) to minimize oxidation.
Formic acid atmosphere for oxide removal (flux alternative).
Precise control for formic acid concentration and flow rate.
High-Speed Thermal Profiling
Rapid heating and cooling (up to 250 °C/min), enabling accurate thermal cycles.
Useful for evaluating solder paste behavior, component stress tolerance, and brazing windows.
Dual-Zone IR Heating
Uniform heating via 8–16 IR lamps, ensuring thermal uniformity across the board.
Critical for testing thermo-sensitive components and fine-pitch soldering.
Overpressure Reflow
Positive pressure up to 4.5 bar to test reflow under compressive gas.
Significantly reduces voids in large pad or die attach areas.
Vacuum Cooling
Rapid cooling in vacuum or inert environment to reduce thermal shock.
Enables evaluation of microcracking, wetting behavior, and grain structure post-reflow.
Programmable Temperature Profiles
Custom thermal profiles for different solder alloys (SnPb, SAC, AuSn, etc.)
Cycle repeatability testing for process validation and optimization.
